GLOBALFOUNDRIES today announced it is taking the Global Technology Conference on the road. On the heels of the inaugural GTC 2010 in California, the company is planning two additional events in October in the Asia Pacific region.
On October 13, GLOBALFOUNDRIES will host a GTC 2010 event at the Ambassador Hotel in Hsinchu, Taiwan. Two days later on October 15, the company will host an event at the Shanghai International Convention Center in Shanghai, China. Both daylong conferences will feature keynotes from industry leaders and presentations from senior members of the GLOBALFOUNDRIES management and technical teams.
“We could not be more pleased with the feedback we received from customers on our inaugural GTC 2010 event in California,” said Bo Cheng, vice president of sales for the Asia Pacific and Japan region at GLOBALFOUNDRIES. “Now we plan to continue the momentum generated by our U.S. conference and carry it forward to our customers and partners in the Asia Pacific region, where we have a long heritage of excellence in manufacturing and customer service.”
In addition to presentations on the company’s global 300mm operations and leading-edge technologies, the Hsinchu and Shanghai conferences will shine a spotlight on GLOBALFOUNDRIES’ legacy in the Asia Pacific region. Senior executives and technologists will highlight key initiatives in the company’s 200mm Business Unit, including its track record of manufacturing automotive-qualified technologies and the company’s strategy to accelerate the move to high-volume manufacturing of Microelectromechanical Systems (MEMS).
The inaugural GTC 2010 was held Wednesday, September 1 at the Santa Clara Convention Center in the heart of California’s Silicon Valley. The event drew close to 2,000 people—more than 30% above the expected attendance—and included participation from 38 members of the company’s GLOBALSOLUTIONS partner ecosystem spanning EDA, IP, design services, mask, and assembly and test.
Senior executives from GLOBALFOUNDRIES laid out the company’s strategy for leadership in the foundry industry and made several key announcements, including the addition of a new 28nm technology offering, the latest details of the roadmap to 22/20nm, and the tape-out of a qualification vehicle based on the ARM® Cortex™-A9 dual processor, an industry first on 28nm High-K Metal Gate (HKMG) technology. Attendees also had the opportunity to hear keynotes from the top technology executives at both AMD and ST Microelectronics, affirming their commitments to “Gate First” HKMG, as well as a panel discussion featuring senior leaders in the EDA/IP industry and the differentiated solutions they offer for GLOBALFOUNDRIES customers.