Arradiance today shipped their first of multiple orders of the GEMStar Atomic Layer Deposition (ALD) system to the School of Electrical Engineering and Computer Science at Oregon State University.
With its capability to process up to 6” diameter wafers using up to eight precursors, GEMStar has the flexibility to deposit atomically thin layers of material on virtually any substrate and was designed with the most challenging high aspect ratio and through-pore deposition applications in mind.
“From our work with sensitive, high aspect ratio microchannel structures we became acutely aware of the need for a system which could repeatably and uniformly deposit complex nanolaminate films efficiently,” explains David Beaulieu, COO of Arradiance. “We also realized that in order to meet the needs of the Research community, the tool needed to be small, but powerful and be flexible enough to handle the wide range of applications, substrates and materials commonly found in lab environments.”
Dr. John F. Conley, OSU Professor states, “The GEMStar has everything our lab environment should need in an ALD tool. It is small, flexible and can handle up to six inch wafers. We also like the 1” height of the chamber that accommodates small, three dimensional objects and the port we can use for in-situ metrology. The design appears to be rugged and easy to service.”
“Our unique experience in materials science, charged particle physics and systems design have been combined to make a truly robust Research system for engineers who are serious about their work,” says Ken Stenton, Arradiance CEO. “Because of the importance of materials research in emerging growth industries such as biomedical, solar, space science, environmental and semiconductor, we saw the need for a research tool with production performance and reliability. We’re confident the GEMStar will meet and exceed that need.”