By Cameron Chai
Nanometrics declared that a Korean memory provider will deploy its UniFire
7900 metrology platform to monitor superior packaging of DRAM devices. The tool
will be utilized to develop through-silicon via (TSV) technology that could
enable future DRAM designs.
The UniFire tool provides multiple features to monitor redistribution
layer(s), micro bump, and TSV patterning. It also enables measurement of
critical dimensions (CD), etch and deposition processes, depth/height/profile
and registration. It can also measure wafer bow, shape and thickness of the
film.
According to Dr. Michael Darwin, vice president of the UniFire and Materials
Characterization Groups at Nanometrics, the tool provides a non destructive,
three-dimensional metrology feature to enable full surface topography monitoring
and does not require multiple, stand alone metrology tools. It is critical to be
able to measure micro bump, TSV and redistribution process accurately to obtain
superior quality DRAM devices that can be used in future wafer scale
packaging.
Source: http://www.nanometrics.com