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Posted in | Nanoelectronics

SUSS MicroTec and TMAT Receive Order from Leading IDM

Published on October 19, 2011 at 8:47 AM

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, and TMAT, a provider of process technology and adhesives for temporary bonding, have received a purchase order for SUSS MicroTec's latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM.

The bonder system is configured to temporarily bond 300mm wafers for 3D integration processes for logic and memory applications using the TMAT adhesive materials and the TMAT process for temporary bonding.

TMAT and SUSS MicroTec have been working on process and equipment qualification over the past months in order to adapt the process to the customer specific wafer and process requirements.

SUSS MicroTec's platform was chosen over competitors' offerings because of the high throughput capability resulting in a superior Cost-of-Ownership and sophisticated process control for high production volume temporary bonding. Installation of the thin wafer handling equipment is scheduled for Q4 2011.

About Thin Materials

Thin Materials AG was founded early 2007. The technology itself, however, is already under development for many more years and has reached market readiness.

The company is based in Munich, Germany, where it has its office and clean room facilities. Any roadmap in the semiconductor industry shows a clear trend towards thinner wafers. While the goal is clear, the paths towards it are sometimes not. The handling of ultra-thin wafers (50 µm and less) is critical. Thin Materials AG has developed a carrier technology for ultra-thin wafers. Thin Materials´ technology allows to thin down wafers to 50 µm and less and to handle the thinned wafer on carrier in subsequent process steps like a "normal" wafer. The "Release Layer", one of Thin Materials´ core technologies, allows the temporary wafer bonding and de-bonding at room temperature afterwards. High topography of 100 µm or more realized for example on bumped wafers can be handled by Thin Material's technology as well.

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