By Cameron Chai
IMS Nanofabrication, a provider of nanoscale direct-write and mask lithography imaging systems for semiconductor production, has inked an equity funding deal with contribution from Photronics, Intel Capital and private investor groups for the commercialization of its electron multi-beam mask exposure tool (eMET) for mask writing applications at sub 22 nm.
The Chief Executive Officer at IMS Nanofabrication, Max Bayerl stated that the extra resources will facilitate the company to exhibit a 256,000 e-beam mask writer column with preliminary introductions by the end of the year 2011. The company confirmed the eMET platform concept’s technical viability through a work carried out under a proof of writing strategy initiative ended in early 2011, he said.
IMS Nanofabrication will use the equity funding to develop a proof-of-concept for its eMET to help infrastructure improvements, column optimization and tool characterization that lead to the tool’s commercialization. Other conditions of the deal were not revealed. The deal is scheduled for closing by 2011 end.
The participation of Photronics in the equity funding round for the eMET technology development will help the company to offer advanced edge mask manufacturing functionality to its clients.
Intel Capital’s Vice President, Keith Larson stated that the company is happy to be a part of the electron multi-beam patterning being developed by IMS Nanofabrication. The 256,000 e-beam mask writer column must be demonstrated successfully in order to meet the demand for high-efficiency mask writing capability at high resolution levels, he said.