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Applied Materials Unveils PECVD Film Technology for Display Manufacturers

Published on March 21, 2012 at 5:27 AM

By Cameron Chai

Applied Materials has introduced a new plasma enhanced chemical vapor deposition (PECVD) film technology for manufacturing high-resolution, high-performance displays for next-generation televisions and tablet computers.

The new AKT-PECVD film allows the utilization of metal oxide-based transistors, which generate tiny, fast-switching pixels to produce high-resolution screens. The advanced insulating film enhances the stability of metal oxide transistors and delivers improved screen performance by offering a dielectric-layer interface for transistors that reduces hydrogen impurities.

Applied Materials’ AKT-PECVD system can uniformly deposit these superior-quality silicon oxide films with high accuracy on glass sheets having a size of up to 9 m2. This capability is the key to obtain low production costs and high manufacturing outputs.

Besides its novel PECVD films, Applied Materials is currently developing sophisticated PVD solutions such as IGZO deposition for metal oxide production. Utilizing its newest rotary cathode array technology, the company demonstrates the deposition of low-defect, homogeneous active layers with lesser materials and higher throughput when compared to existing PVD solutions.

According to Tom Edman, Group Vice President and General Manager for AKT Display Business Group at Applied Materials, the investments made by display manufacturers in metal oxide transistor capability are ever-increasing, and the company’s advanced PECVD films break the barrier in deploying this key technology by tackling the stability and uniformity issues of the complex dielectric films. The company has offered a quick and low-cost approach for bringing this technology to the marketplace, by extending the functionalities of its AKT-PECVD system for dielectric film deposition for metal oxide transistors.

Source: http://www.appliedmaterials.com

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