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EV Group Introduces High-Volume Room-Temperature Wafer Debonding Platform

Published on July 2, 2013 at 3:12 AM

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its LowTemp™ debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain.

EV Group's LowTemp™ room-temperature debonding platform is available on the company's temporary bonding/debonding systems, including the EVG850TB/DB XT Frame platform

The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding (TB/DB) systems-UV laser debonding and multilayer adhesive debonding-in addition to EVG's ZoneBOND® technology, which has already been implemented into production across the compound semiconductor and advanced packaging markets. EVG's LowTemp debonding platform is complemented by a supply chain of seven material suppliers, with a wide choice of qualified adhesives that support a variety of bonding applications and offer greater process flexibility for customers.

"For more than 15 years, EVG has provided leading-edge temporary bonding and debonding solutions to our customers," commented Paul Lindner, EVG's executive technology director. "The experience and know-how that we've built up from our numerous installations in high-volume manufacturing has taught us that one solution doesn't fit all applications when it comes to temporary bonding/debonding. Accordingly, EVG offers highly flexible and modular equipment, a wide choice of qualified materials to support customers' individual requirements and multiple source policies, and process development and implementation support through our worldwide application labs and cleanroom infrastructure across a range of applications-including interposers, stacked memory, memory on logic, power devices and compound semiconductors."

EVG's LowTemp debonding platform adds to the company's already comprehensive portfolio of temporary bonding/debonding and thin-wafer handling solutions based on tape debonding and thermal slide-off debonding technology. The LowTemp debonding platform is available on EVG's full line-up of TB/DB systems, including the recently announced EVG850TB/DB XT Frame high-volume production platform, which can achieve a throughput of more than 40 wafer stacks per hour and features an optional, integrated in-line metrology module that takes up to 300,000 measurement points at unprecedented speeds to enable real-time monitoring of the bonding/debonding process for maximum yields.

Source: http://www.evgroup.com/

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