SEMATECH today announced that Air Products, a global industrial gas and technology leader, has joined its Front End Processes (FEP) program, and will work with SEMATECH to assess advanced materials and technologies for the development of sub-10 nm node III-V devices.
Continued scaling will require the use of new materials and chemistries to keep pace with the International Technology Roadmap for Semiconductors (ITRS). For example, III-V channels offer significant power and performance benefits, such as higher mobility, enhanced drive current and supply voltage scaling which enable continued device scaling and performance improvement.
As a member of this program, located at SUNY’s College of Nanoscale Science and Engineering (CNSE), Air Products will closely collaborate with SEMATECH's engineers and leverage SEMATECH's activities in advanced materials to enable better understanding of the underlying principles responsible for the deposition of III-V structures. The goal of this team will be to help guide the development of new chemical products that address a wide variety of needs for next generation semiconductor devices.
“Air Products will be cooperating with SEMATECH to accelerate the introduction of innovative products to the marketplace,” said Dr. John Langan, the Global Director of Electronics Technology for Air Products. “By leveraging the capabilities of SEMATECH, we are accelerating new product development to fulfill the requests we are receiving for electronics materials from our industry partners.”
“SEMATECH is pleased to welcome Air Products as a partner,” said Paul Kirsch, director of SEMATECH’s FEP program. “Air Products long standing and deep expertise in specialty materials will complement our own device and process expertise. We will work together to develop practical and promising manufacturable solutions to address the emerging needs of the advanced transistor markets.”
The goal of SEMATECH’s FEP program is to provide novel leading-edge materials, processes, structural modules and electrical and physical characterization methods to support the continued scaling of logic and memory applications.