New Project to Develop ALD Materials and Tools for High-Density 3D Integrated Capacitors

Published on October 24, 2013 at 6:26 AM

CEA-Leti, Fraunhofer IPMS-CNT and three European SMEs, IPDiA, Picosun and SENTECH Instruments, have launched a project to industrialize 3D integrated capacitors with world-record density.

The two-year, EC-funded PICS project is designed to develop a disruptive technology that results in a new world record for integrated capacitor densities (over 500nF/mm2) combined with higher breakdown voltages. It will strengthen the SME partners’ position in several markets, such as automotive, medical and lighting, by offering an even higher integration level and more miniaturization.

The fast development of applications based on smart and miniaturized sensors in aerospace, medical, lighting and automotive domains has increasingly linked requirements of electronic modules to higher integration levels and miniaturization (to increase the functionality combination and complexity within a single package). At the same time, reliability and robustness are required to ensure long operation and placement of the sensors as close as possible to the “hottest” areas for efficient monitoring.

For these applications, passive components are no longer commodities. Capacitors are indeed key components in electronic modules, and high-capacitance density is required to optimize – among other performance requirements – power-supply and high decoupling capabilities. Dramatically improved capacitance density also is required because of the smaller size of the package.

IPDiA has for many years developed an integrated capacitors technology that out performs current technologies (e.g. tantalum capacitors) in terms of stability in temperature, voltage, aging and reliability. Now, a technological solution is needed to achieve higher capacitance densities, reduce power consumption and improve reliability. The key enabling technology chosen to bridge this technological gap is atomic layer deposition (ALD) that allows an impressive quality of dielectric.

The PICS project consortium will address all related technological challenges and set up a cost-effective industrial solution. Picosun will develop ALD tools adapted to IPDiA’s 3D trench capacitors. SENTECH Instruments will provide a new solution to more accurately etch high-K dielectric materials. CEA-Leti and Fraunhofer IPMS-CNT will help the SMEs create innovative technological solutions to improve their competitiveness and gain market share. Finally, IPDiA will manage the industrialization of these processes.

About PICS
The PICS project has received funding from the European Union's Seventh Framework Program managed by REA-Research Executive Agency http://ec.europa.eu/rea (FP7/2007-2013) under grant agreement n° FP7-SME-2013-2-606149.

The PICS Project will last for two years and the consortium consists of three SMEs: IPDiA (France, coordinator), Picosun (Finland) and Sentech Instruments (Germany), and two leading research organizations: Fraunhofer IPMS-CNT (Germany) and CEA-Leti (France). Project objectives are to bring to mass production high density and high voltage capacitors based on ALD and etching development.

Further information is available at www.fp7-pics.eu

Source: http://www-leti.cea.fr

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