Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer (MPW) stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate (HKMG) processes.
Over 100 IPs from multiple third party IP partners as well as SMIC's internal IP team are prepared to serve various projects from worldwide design houses that have been showing interest in SMIC 28nm processes.
28nm process technologies primarily target mobile computing and consumer electronics related applications, such as Smartphone, Tablets, TV, Set-top Boxes and networking. It provides customers high performance application processors, cellular baseband, wireless connectivity etc. According to IHS' forecasts, the pure-play foundry revenue potential for 28nm will continue to rise with a CAGR of 19.4% from 2012 to 2017.
"I am pleased to announce the successful 28nm process milestone, which enables SMIC to better position itself in engaging and serving mobile computing related customers," said Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC. "As the first foundry in mainland China to offer 28nm process technologies, this significant milestone demonstrates SMIC's continuous growing capabilities in offering leading foundry technologies to worldwide IC designers."
"The first SMIC 28nm MPW shuttle included both 28PS and 28HKMG related customer products for verification, which was already launched at the end of 2013 as planned," said Dr. Shiuh-Wuu Lee, Executive Vice President of Technology Development of SMIC. "By taking more MPW shuttles in 2014, we will continue to take more positive steps to strengthen and diversify our technology offerings and meet customers' growing demands on both advanced and differentiated technologies."
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com.