Rudolph Technologies, Inc. announced today that it has received multi-system orders from several customers for its latest MetaPULSE® G metal metrology system in support of their mobile device components ramp.
The MetaPULSE systems will provide critical process control metrology enabling the manufacture of advanced multi-band and multi-mode frequency components used in the latest generation of smartphones and mobile devices. The MetaPULSE G system is the most capable metrology tool for measuring multilayer films simultaneously within a device.
“Consumer demand for more power and higher functionality from handheld devices and the burgeoning Internet of Things (IoT) are driving continued technological innovation in the mobile and connected device markets. As a result, we see tremendous growth in specialty components such as MEMS sensors, frequency filters and power devices supporting the mobile and wireless IC market,” states Tim Kryman, director of metrology product management. “Many of these critical components are being manufactured using 200mm legacy infrastructure accompanied by newly developed processes and expanded capacity to support the continued market growth. Rudolph’s metrology systems are uniquely positioned to take advantage of this growth.”
Kryman adds, “We are pleased that MetaPULSE G systems are being adopted for the process control of critical devices driving growth in expanding mobility and IoT markets. Not only are we providing advanced process control metrology to our customers, but we also deliver wafer handling solutions tailored to the smaller substrate sizes used for these devices.”
Rudolph’s MetaPULSE system uses a laser-induced ultrasonic sonar pulse to characterize thickness, density and other parameters of single layers or multi layered stacks of opaque materials, non-destructively and without interference from underlying layers. The MetaPULSE G system delivers superior performance on metal films, and is optimized for thin single and multilayer applications that are critical in advanced logic, memory and 3D packaging processes. Unlike optical and x-ray techniques, PULSE™ Technology can be used in active die without special test pads. Its 10x10 micron spot size assures measurement capability on product wafers in 15x15 micron test sites.
Source: http://www.rudolphtech.com/