Research and Markets has announced the addition of the "Bosch Sensortec BMA355 - 3-Axis MEMS Accelerometer - Technology Analysis" report to their offering.
After being integrated in the latest Apple's iPhone in 2013, Bosch is now the top MEMS supplier according to Yole's Top 30 MEMS Ranking 2014. This strong growth is mainly due to the consumer and mobile business of Bosch Sensortec.
With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS accelerometers. This size reduction has been made possible by the use of a WLCSP package where all the manufacturing steps are realized at the wafer-level. To interconnect MEMS and ASIC with a WLCSP package, Through-Silicon Vias (TSVs) are used, introducing the first MEMS component with TSV Via-Middle process.
The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring extremely small form factors.
The Technology Analysis report provides information on Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis is also available, for more information please click on the link below.
Key Topics Covered:
1. Glossary
2. Introduction, Bosch Sensortec Company Profile
3. Physical Analysis
Package
- Package Views & Dimensions
- Package Opening
- Package Cross-Section (TSV, RDL)
ASIC Die
- View, Dimensions & Marking
- Delayering
- Main Blocks Identification
- Process Identification
- Cross-Section
MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening
- Cap Removed & Cap Details
- Sensing Area Details
- Cross-Section (Sensor, Cap & Sealing)
- Process Characteristics
Consumer 3-Axis Accelerometer Comparison
4. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process & Wafer Fab Unit
- MEMS Process Flow & Wafer Fab Unit
- WLP Process Flow & Assembly Unit
For more information visit http://www.researchandmarkets.com/research/lrpx2q/bosch_sensortec
Source: http://www.researchandmarkets.com/