Copper Barrier CMP Technology Improved With Cabot Microelectronics CMP Slurries For Low K Devices

Published on July 11, 2007 at 1:52 PM

Cabot Microelectronics Corporation, the world’s leading supplier of chemical mechanical planarization (CMP) polishing slurries to the semiconductor industry, announces a major breakthrough in its CMP technology with improvements to its B6600 platform of barrier CMP slurries for advanced technology nodes.

Cabot Microelectronics is the leading supplier of copper polishing slurry solutions for the semiconductor industry. The B6600 barrier slurry platform builds on Cabot Microelectronics’ industry-leading CMP slurry technology and is the result of extensive research and development by Cabot Microelectronics intended to deliver an integrated, best-in-class solution for copper barrier CMP at advanced technology nodes.

Cabot Microelectronics’ B6600 barrier slurry platform is tunable, enabling the products to be easily customized to deliver excellent planarity and defect performance across a wide range of integration schemes. Recent technology advancements made by Cabot Microelectronics’ scientists provide excellent low-K dielectric and copper removal rate control, resulting in superior electrical performance. The B6600 barrier slurry products are being produced and used worldwide for technology nodes from 90 nm through 45 nm.

Thomas Kelly, Cabot Microelectronics’ Global Business Director for Copper and Barrier products, stated, “Our new line of advanced barrier slurry products is designed to provide customers with greatly enhanced flexibility to customize and fit their specific processes. Further, the B6600 platform of products offers customers electrical performance that is unmatched in the market with an attractive cost of ownership.”

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