Technology, Inc., a world-leading provider of advanced
semiconductor assembly and test services, and IMEC, a leading
independent non-profit nanoelectronics and nanotechnology research
center based in Belgium, today announced that they have entered into a
2-year collaboration agreement to develop cost-effective, 3D
integration technology based on wafer-level processing techniques.
"This collaboration with IMEC will enhance our continuing
efforts to develop low cost, state of the art packaging solutions for
our customers", said Dan Mis, Amkor’s Senior Vice President
for Wafer Level Advanced Product Development.
Luc Van den hove, IMEC’s Executive Vice President
and Chief Operating Officer, commented "We are pleased that one of the
leading semiconductor packaging service providers has joined our 3D
system integration program that targets the development of
post-passivation technology for 3D interconnects at the IC bond pad