IMEC and CEA-LETI launch ePIXfab, the continuation of their successful multi-project
wafer silicon photonics prototyping service started in 2006. Co-funded by the
European Union through the Seventh Framework Program and coordinated by IMEC,
ePIXfab aims at reducing the large barriers for access to and market take-up
of silicon photonics technology by focusing on reduced cost, risk and design
effort, education, and roadmapping.
With their joint initiative ePIXfab, IMEC and CEA-LETI continue to offer a
cost-effective way for researchers and SMEs (small and medium sized enterprises)
to prototype photonic integrated circuits in silicon. ePIXfab organizes shuttle
(also called multi project wafer) fabrication runs with IMEC and LETI wafer-scale
technologies, including 193nm deep-UV lithography-based processes. Now, IMEC
and LETI have agreed to significantly extend this service to enable a broader
market take-up of silicon photonic IC technology. Dedicated prototyping and
small-volume manufacturing is also possible based on IMEC or LETI technology.
A wider offering
Starting in September 2008, the PhotonFAB project will provide the ePIXfab
service with a more extensive technology portfolio, new design libraries, education
and training for the clients, a shuttle service roadmap and a more streamlined
operation. Funded by the European Union as a FP7 Support Action, PhotonFAB will
in this way lower the design effort, risk and bare costs for the clients. In
addition, clients from countries fully associated to the FP7 program will be
able to get additional cost reductions for the shuttle service and training
activities.
Silicon photonics IC technology enables versatile and highly functional integrated
circuits that handle light information. Photonic integrated circuits are used
in applications such as communication networks, sensors, monitoring and bio-analysis.
Using silicon allows to increase the functionality of a photonic chip by several
orders of magnitude. By manufacturing with CMOS technology, the chips are reliable
and can be used in volume applications.
Since 2006, thanks to the collaboration between IMEC and CEA-LETI, over 25
academic and SME groups have been able to perform their research and develop
their IC technology in a fabless way with reduced costs, by joining many IC
designs in a single fabrication run,
Information sessions
ePIXfab will organize two information sessions for its fabrication service
and on the PhotonFAB project: one at the IEEE Group IV Photonics conference,
September 17-19 2008, Sorrento, Italy, and a second one at the European Conference
and Exhibition on Optical Communication 2008 (ECOC), September 21-25 2008, Brussels,
Belgium
Detailed information on these events and the ePIXfab services is available
from www.epixfab.eu