Today, KLA-Tencor Corporation
introduced the Surfscan SP2XP, a new monitor-wafer inspection system for the
integrated circuit (IC) market that builds upon the success of its sister tool
with the same name, introduced last year for the wafer manufacturing market.
The new Surfscan SP2XP features improved sensitivity to defects on silicon,
poly and metal films and enhanced ability to sort defects by type and size,
compared with its predecessor, the industry-leading Surfscan SP2. It also features
vacuum handling and best-in-class throughput. These capabilities are designed
to enable chipmakers to bring their leading-edge devices to market faster by
delivering superior process tool monitoring throughout the fab. The new system
also introduces an ultra-high sensitivity operating mode to accelerate fabs'
development of 3Xnm and 2Xnm next-generation devices.
“Manufacturers of high performance devices are seeing the complexity
of the chip-making process increase at the same time that market windows for
these devices are tightening,” observed Mike Kirk, vice president and
general manager of the Wafer Inspection Group at KLA-Tencor. “The Surfscan
SP2XP system addresses the need to quickly flag process tools which are generating
excessive defectivity, so that the problem can be corrected with minimal wafer
scrap, yield loss and market delay. Our new tool addresses this challenge, not
only through advancements in sensitivity and throughput, but also by introducing
the capability to distinguish particles from microscratches and residues without
the need to expend resources on SEM review. We believe the Surfscan SP2XP will
help fabs accelerate production of their leading-edge devices.”
Opto-mechanical and signal processing improvements are designed to ensure capture
of even the smallest defects on bare wafers, as well as front-end and back-end
films. Unique, patented multi-channel architecture and innovative algorithms
enable the Surfscan SP2XP system to automatically differentiate defect types.
The tool also delivers superior throughput to that of the previous-generation,
industry-leading Surfscan SP2, enabling fabs to inspect more wafers per hour
or to use a higher sensitivity setting without loss of throughput. The Surfscan
SP2XP upholds the platform’s reputation for reliability, ease-of-use and
system matching.
Strong interest in the Surfscan SP2XP system has resulted in several orders
from fab equipment manufacturers as well as leading logic and memory fabs in
Asia, the United States and Europe. The January 2007 release of the edge-handling
version of the Surfscan SP2XP system, for the wafer manufacturing market, has
rapidly gained broad market acceptance, with installations of multiple systems
at every leading wafer manufacturer.
TECHNOLOGY SUMMARY
Improvements to mechanical, optical and signal-processing subsystems enable
the Surfscan SP2XP monitor-wafer inspection system to deliver several advantages
over its predecessor, the industry-leading Surfscan SP2. These include:
- Up to 36 percent throughput boost resulting from a combination of changes
in opto-mechanics, electronics and software
- Unique, patented multi-channel architecture that enables the Surfscan SP2XP
system to automatically distinguish particles from microscratches, voids,
watermarks and other residues
- The introduction of Ultra-High Sensitivity mode, allowing the Surfscan
SP2XP system to be utilized for development of next-generation chips
- An opto-mechnical innovation that enhances the tool’s sensitivity
to defects on rough films such as polysilicon, tungsten and copper. Together
with the platform’s benchmark sensitivity on smooth films, the new capability
allows the Surfscan SP2XP platform to be used throughout the fab, thereby
yielding potential improvements to the fab’s operating efficiency
- A new differential interference contrast (DIC) channel that enables capture
of shallow, flat and faint defects-of-interest such as residues or bumps—all
of which can result in device failure, particularly for advanced devices
- Newly extended defect sizing capability, delivering improved defect binning
accuracy for faster identification of the defect source