SUSS MicroTec., a leading
supplier for process and test solutions for the semiconductor industry announces
that SUSS MicroTec Inc., manufacturer and supplier of production and process
wafer bonding systems, now holds the globally recognized ISO 9001 certification
for having established a high level process and system-oriented quality management
(QM) based on ISO 9001 standards. Proceeding the ISO certification of SUSS MicroTec
Lithography GmbH in 2007, another division of the SUSS MicroTec group has been
certified for international quality standards. This is in line with on-going
efforts to increase efficiency and alignment within the SUSS MicroTec group.
SUSS MicroTec Inc., based in Vermont, is the Bonder Division headquarters and
North American sales and service site for all SUSS products. The fastest growing
division of the SUSS MicroTec group, the Bonder Division develops and manufactures
wafer bonders for high-volume MEMS and Semiconductor markets.
The ISO 9000 series of standards represents an international consensus of quality
management practices. Providing a consistent set of criteria for the development
and acceptance of corrective action and responses is a part of the audit process.
This has assisted SUSS MicroTec in their drive to managing their manufacturing
process effectively and giving customers continued confidence. The ISO certification
validates the effectiveness and strength of SUSS MicroTec’s quality management
systems as well as their assurance of continuous improvement.
“Achieving ISO 9001-2000 certification reflects our dedication and on-going
commitment.”, said Wilfried Bair, VP Business Development and General
Manager, Bonder Division, ”It shows our customers that we are producing
leading-edge and top quality wafer processing equipment covering all steps from
design and development, to manufacturing, installation and after-sales support.”