SUSS MicroTec, supplier of innovative solutions for 3D Integration (3DI), MEMS, Advanced Packaging and Nanotechnology markets, launches the third generation of its MA/BA8, a manual mask and bond aligner that offers highest process flexibility including submicron alignment and exposure optics dedicated for thick resist exposure. In addition it allows easy and fast upgrades to emerging technologies such as UV-nano imprinting, microlens imprinting, UV-bonding and enhanced bond alignment. The new MA/BA8 Gen3 from SUSS MicroTec combines an unmatched resolution and light uniformity with a high-precision alignment capability down to 0.25µm, the highest accuracy for a mask aligner available today.
The ability to easily process virtually all kinds of wafer and substrate materials makes the new manual aligner from SUSS MicroTec a preferred solution also for production environments, where it addresses the growing demand for tighter process control. Processes developed on the MA/BA8 Gen3 can be quickly transferred onto an automated SUSS Mask Aligner for high-volume production, as both aligner platforms are based on the same SUSS technology.
“The MA/BA8 has been designed to enable quick and effective development of new process technologies and products”, explained Rolf Wolf, general manager of SUSS MicroTec’s Lithography Division, “Research organizations will benefit from the enhanced capabilities of the MA/BA8 Gen3 as it allows them to develop their processes with industry-standard equipment.”