SUSS MicroTec and Surface
Technology Systems, two leading providers of process and test solutions for
the semiconductor industry are hosting an advanced technology roadshow in five
major cities in Asia from October 29 to November 7. The series of one-day events
is building on the success of the US roadshow this spring and will provide a
comprehensive overview of the latest developments in the field of 3D Integration
and Advanced Packaging.
Invited speakers from companies such as Panasonic, IBM and Fraunhofer IZM will
discuss the optimization of integrated process solutions in respect to performance
and cost. Topics cover applications like plasma-dicing, metal-to-metal wafer-level
bonding, electrostatic carriers for thin wafer handling, as well as thin chip
integration. SUSS MicroTec and co-host STS will demonstrate leading-edge total
process solutions for 3D wafer level packaging by combining the expertise of
STS in deep reactive ion etch (DRIE) for via fabrication and SUSS MicroTec in
photolithography and wafer bonding.
The roadshow will take place at following dates and locations:
- Tokyo, Japan: October, 29
- Shanghai, China: October, 31
- Seoul, South Korea: November, 3
- Hsinchu, Taiwan: November, 5
- Singapore: November, 7
Further information is available at www.suss.com/roadshow