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Tegal Ships Deep Reactive Ion Etch System Following Acquisition of AMMS Product Lines

Published on November 12, 2008 at 10:20 AM

Tegal Corporation (NASDAQ:TGAL), a leading designer and manufacturer of plasma etch and deposition systems, announced today that the Company had shipped a Tegal 200SE ICP deep reactive ion etch (DRIE) system to a leading supplier of substrates and services in the integrated circuit and MEMS sensor markets. The new Tegal DRIE system is currently being installed at the customer’s 150mm production foundry.

“Tegal is very pleased to have shipped our first Tegal 200SE ICP Silicon Etch System following our acquisition of the Alcatel Micro Machining Systems (AMMS) product lines in September,” said Thomas Mika, President and CEO of Tegal Corporation. “We worked very hard to make the sales and qualification process seamless for our customer, who has added Tegal’s DRIE system to its existing tool set. The fact that this customer has made the choice for Tegal, after working in MEMS production for many years, is a strong endorsement of the Tegal / AMMS 200SE track record for production-proven performance.”

The Tegal 200SE system is a high-density plasma etch tool featuring an inductively coupled plasma etch reactor and magnetic plasma confinement. The tool can run Tegal’s patented SHARP &ndash Super High Aspect Ratio Process, achieving etched feature aspect ratios of > 100:1 in production environments. Together with its high reliability, broad process window, and high etch rates, the Tegal 200SE system is a critical enabler for etching the Silicon and SOI substrates found in the MEMS/MOEMS, photovoltaic, bio-tech and hi-voltage markets.

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