Skyray XRF has released
the newest addition to its low-cost x-ray fluorescence instrument line; the
Thick-800. Developed specifically for measuring plating thickness, the Thick-800
XRF can provide measurements of single-layer, multi-layer, thin-film coatings
and solders with composition.
The Thick-800 XRF Instrument from Skyray XRF is the first unit in the product
line-up to feature a top-down measurement system. This style allows for a sample
stage with three-dimensional movement; with the press of a button the sample
can move from point to point on a sample or up and down if needed. The top-down
measurement system also allowed Skyray XRF to offer a three-sided chamber door
so that users can measure smaller samples with the door closed (chamber size
of 20”x14”x5”) or open the door to create a ‘slotted
chamber’ and fit larger samples or printed circuit boards.
This system utilizes an electro-cooled Silicon-PIN semiconductor detection
system, which offers a resolution of 149-160eV and does not require Liquid Nitrogen
(LN2). To insure sample alignment accuracy, the Thick-800 was developed with
a color-camera sample viewing system and double laser position technology. Many
organizations that utilize XRF for coating thickness measurements look to reconditioned
instruments to limit costs, but the low-cost Thick-800 allows a company with
any sized budget to utilize the newest, most reliable technology.
“Our focus to this point has been offering low-cost, high-performing
units for precious metal analysis and hazardous substance detection,”
stated Scott Kramer, Director of Sales and Marketing for Skyray XRF. “The
Thick-800, in addition to the EDX-600, allows us to offer low cost testing solutions
for another common application.”
Skyray XRF is the North American representative of an international leader
in x-ray fluorescence technology. Overviews of the full product line, applications
and XRF technology can be found at www.skyrayxrf.com.