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IMEC Announces Collaboration with Replisaurus on 3D Integration Research

Published on January 13, 2009 at 1:22 AM

S.E.T. Smart Equipment Technology, a wholly-owned subsidiary of Replisaurus Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announced today that they will collaborate with IMEC, one of Europe's leading independent nanoelectronics research institutes, on the development of die pick-and-place and bonding processes for 3D chip integration, using S.E.T.'s Flip Chip bonder equipment.

IMEC’s 3D integration program explores 3D technology and design for applications in various domains, focusing on 3D wafer-level packaging and 3D stacked-ICs to find innovative solutions for the cost-effective use of 3D interconnects.

The joint development program will employ S.E.T.'s FC300, which is a high-accuracy (=0.5 µm), high force (4,000N) device bonder system for die-to-die and die-to-wafer bonding on wafers up to 300 mm. The program is scheduled to begin during the first quarter of 2009, at which time S.E.T. will enter the IMEC’s Industrial Affiliation Program (IIAP) on 3D integration. The parties will collaborate to develop highly-accurate pick-and-place processes and low-temperature bonding processes, which are required by advanced 3D integration schemes.

"The integration of the FC300 will be a welcome addition to our 3D program, as is the participation of S.E.T. and Replisaurus," said Luc van den Hove, Executive Vice President and COO of IMEC. "The Replisaurus and S.E.T. technologies are very interesting for advanced packaging applications, and the integration of this tool in particular will help complete our program."

"IMEC's installation of the FC300 is fully in line with Replisaurus' product and technology portfolio, which offers game-changing opportunities to the global chip market," said James Quinn, CEO of Replisaurus. "IMEC's advanced 3D integration program is recognized worldwide, and the FC300 is extremely complimentary to Replisaurus' ElectroChemical Pattern Replication (ECPR) technology, which is well-suited for advanced 3D integration and related applications."

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