S.E.T. Smart Equipment Technology, a wholly-owned subsidiary of Replisaurus
Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer
(D2W) bonding and nanoimprint lithography solutions, announced today that they
will collaborate with IMEC,
one of Europe's leading independent nanoelectronics research institutes, on
the development of die pick-and-place and bonding processes for 3D chip integration,
using S.E.T.'s Flip Chip bonder equipment.
IMEC’s 3D integration program explores 3D technology and design for applications
in various domains, focusing on 3D wafer-level packaging and 3D stacked-ICs
to find innovative solutions for the cost-effective use of 3D interconnects.
The joint development program will employ S.E.T.'s FC300, which is a high-accuracy
(=0.5 µm), high force (4,000N) device bonder system for die-to-die and
die-to-wafer bonding on wafers up to 300 mm. The program is scheduled to begin
during the first quarter of 2009, at which time S.E.T. will enter the IMEC’s
Industrial Affiliation Program (IIAP) on 3D integration. The parties will collaborate
to develop highly-accurate pick-and-place processes and low-temperature bonding
processes, which are required by advanced 3D integration schemes.
"The integration of the FC300 will be a welcome addition to our 3D program,
as is the participation of S.E.T. and Replisaurus," said Luc van den Hove,
Executive Vice President and COO of IMEC. "The Replisaurus and S.E.T. technologies
are very interesting for advanced packaging applications, and the integration
of this tool in particular will help complete our program."
"IMEC's installation of the FC300 is fully in line with Replisaurus' product
and technology portfolio, which offers game-changing opportunities to the global
chip market," said James Quinn, CEO of Replisaurus. "IMEC's advanced
3D integration program is recognized worldwide, and the FC300 is extremely complimentary
to Replisaurus' ElectroChemical Pattern Replication (ECPR) technology, which
is well-suited for advanced 3D integration and related applications."