At Semicon Korea 2009, SUSS
MicroTec (FWB:SMH)(GER:SMH) unveiled the second generation of its ACS300,
a modular system for coating, baking and developing of wafers up to 300mm. The
ACS300 Gen2 offers unmatched configuration flexibility at market-leading cost
of ownership.
Frontview ACS300 Gen2 modular coat/bake/develop system from SUSS MicroTec (Photo: Business Wire)
The system architecture and process modules are specifically adapted to the
needs of the advanced packaging and 3D integration industry, which requires
very thick photo resist layers of up to 100 microns and more. Combining best
in class coat and develop uniformity with exceptional edge bead performance
makes the ACS300 Gen2 the preferred solution for various special spin coating
applications such photosensitive polymers like polyimide, PBO or Cyclotene™
(BCB).
The ACS300 Gen2 continues the success of the preceding model, ACS300Plus with
developments driving equipment cost down, extending overall equipment efficiency
and scaling down of the footprint.
"Addressing the specific requirements for wafer level packaging and 3D
integration the new ACS300 is equipped with various packaging specific features,
which makes it specifically suited for applications like solder bumping, gold
bumping or redistribution layers," said Rolf Wolf, General Manager of SUSS
MicroTec Lithography Division. "The next generation ACS300 will definitively
help SUSS MicroTec to continue and further expand its market leading position
in the field of advanced packaging, and extending it into 3D processing."
Posted January 20th. 2009