MST.factory dortmund, a renowned center of competence for micro and nanotechnology
based in Germany, has purchased the CB8 High Performance Wafer Bonder from SUSS
MicroTec (FWB:SMH)(GER:SMH), a leading supplier of innovative process and
testing solutions. This purchase continues last year's success when SUSS MicroTec
has won more than 80% of the MEMS production wafer bonder orders to become the
dominant Advanced MEMS market shareholder in wafer bonding.
The CB8 semi-automated 200mm wafer bonder recently installed at MST.factory
dortmund is being used to develop processes for advanced wafer bonding, particularly
for Cu-Cu, Au-Au, Al-Al and other state of the art advanced MEMS bonding techniques.
Recipes developed on the CB8 can easily be transferred to the CBC200 Wafer Bond
Cluster for a smooth transition from the lab or low-volume production to full
production. The highly versatile CB8 was chosen over competitive systems for
its capability to run all advanced MEMS bond processes including eutectic, fusion,
and metal diffusion that are needed to support the innovative micro/nanotechnology
requirements of MST.factory’s various business partners.
“With the trend for 200mm MEMS manufacturers to move to MEMS foundries
utilizing advanced metal bond technologies we are very pleased to be accepted
as the supplier of choice for bonders to help MEMS manufacturers achieve significant
size and cost reduction for their devices” said Wilfried Bair, General
Manager of the bonder division, SUSS MicroTec, “We see MST.factory’s
selection of the CB8 for process development as a positive sign that these advanced
technologies will soon be in production on SUSS equipment.”