Without robust and affordable next-generation lithography, the current semiconductor
roadmap could change dramatically. For 22nm and beyond, patterning candidates
such as EUVL*, nano-imprint, direct write and optical double patterning methods
show promise. But which one will deliver the best balance of performance and
cost? On February 25, in San Jose, California, Applied Materials will host an
important seminar exploring this critical topic.
Titled “Next Generation Lithography Technologies: Yielding Moore with
Less,” the forum will be led by Dr. Hans Stork, chief technology officer
of Applied Materials’ Silicon Systems Group. The program will feature
an afternoon of technical presentations discussing new patterning, inspection
and metrology techniques and their influence on lithography. The presentations
will be followed by an exploratory look into the world of 22nm chip design with
a live demonstration of decomposition tools for 22nm sidewall spacer double
patterning. Experts drawn from academia; circuit design; and logic, memory and
foundry manufacturing will round out the program with a spirited debate on lithography
technology for the future.
For more information on this compelling event, please visit www.appliedmaterials.com/2009_SPIE.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing
Technology™ solutions with a broad portfolio of innovative equipment,
service and software products for the fabrication of semiconductor chips, flat
panel displays, solar photovoltaic cells, flexible electronics and energy efficient
glass. At Applied Materials, we apply Nanomanufacturing Technology to improve
the way people live. Learn more at www.appliedmaterials.com.
*EUVL = extreme ultraviolet lithography