Applied Materials Hosts Forum to Explore Emerging Lithography Technologies

Published on February 13, 2009 at 7:48 AM

Without robust and affordable next-generation lithography, the current semiconductor roadmap could change dramatically. For 22nm and beyond, patterning candidates such as EUVL*, nano-imprint, direct write and optical double patterning methods show promise. But which one will deliver the best balance of performance and cost? On February 25, in San Jose, California, Applied Materials will host an important seminar exploring this critical topic.

Titled “Next Generation Lithography Technologies: Yielding Moore with Less,” the forum will be led by Dr. Hans Stork, chief technology officer of Applied Materials’ Silicon Systems Group. The program will feature an afternoon of technical presentations discussing new patterning, inspection and metrology techniques and their influence on lithography. The presentations will be followed by an exploratory look into the world of 22nm chip design with a live demonstration of decomposition tools for 22nm sidewall spacer double patterning. Experts drawn from academia; circuit design; and logic, memory and foundry manufacturing will round out the program with a spirited debate on lithography technology for the future.

For more information on this compelling event, please visit www.appliedmaterials.com/2009_SPIE.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live. Learn more at www.appliedmaterials.com.

*EUVL = extreme ultraviolet lithography

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