IMEC technologists will
present their newest breakthroughs in advanced semiconductor lithography research
and development at next week's SPIE
Advanced Microlithography Conference, to be held February 23 - 27 in San Jose,
IMEC will present a record 26 papers at the conference. The papers report progress
realized by IMEC and its world-leading core partners on EUV and double patterning
lithography targeting the sub-32nm node. The range of lithography challenges
are covered, including materials, manufacturing process technology, metrology,
inspection, process control, optical microlithography, design for manufacturing,
and alternative lithographic processes.
“Stimulated by these record number of papers and with a concerted effort
from all actors involved in double patterning and EUV lithography research,
IMEC is determined to advance cost-effective double patterning towards the 32nm
node and EUV full speed towards the (sub-)22nm node”, stated Kurt Ronse,
Advanced Lithography Program Director of IMEC. “SPIE provides the prestigious
forum for the industry’s technologists to share findings and move semiconductor
manufacturing forward to accomplish this common service.
Kurt Ronse continued, “As technologists, our goal is to enable engineers
and scientists to see their IC designs become reality through manufacturing.
Through IMEC’s collaborative research, we have achieved many milestones
to discuss with our international colleagues.”