Nemotek Technologie, a manufacturer of customized wafer-level cameras for
portable applications, has selected multiple lithography systems from SUSS
MicroTec (FWB:SMH) (GER:SMH), a supplier of innovative solutions for the
3D Integration, Advanced Packaging, MEMS and Nanotechnology markets. The deal
includes a 200mm production mask aligner, coat, bake and develop systems. The
systems have been selected for their image sensor wafer-level packaging (WLP)
and wafer-level optics (WLO) services and were successfully installed at Nemotek's
facility in Rabat Technopolis Park, Morocco.
SUSS MicroTec provides dedicated equipment for the CMOS image sensor market,
which is mainly driven by camera phones. Its packaging revenue is expected to
grow more than 150% within the next three years, according to market analyst
"We truly believe that wafer-level camera solutions are the technologies
of the near future," said Jacky Perdrigeat, CEO of Nemotek Technologie.
"Therefore we're looking to partner with companies that can deliver
innovative manufacturing approaches and support to help us realize our goals
of productivity, cost reduction and are able to integrate the future technology
trend of this industry. SUSS MicroTec's spin coaters and mask aligner
technology proved to meet our stringent requirements - offering high-quality
processing results and an excellent cost-of-ownership."
Lithography systems from SUSS MicroTec are becoming critically important for
applications like 3D image sensor packaging. The highly precise alignment capability
coupled with specificly designed exposure optics make mask aligners of SUSS
MicroTec the tool of choice for thick-resist applications. SUSS MicroTec coat
and develop solutions include a novel dispense system, optimized for a wide
range of different materials and viscosities in particular solder mask resist.
The SUSS lithography technology guarantees most effective patterning for WLP
and 3D Integration applications.