Today, KLA-Tencor Corporation
(NASDAQ:KLAC) and Tokyo Electron Limited (TEL) announced AcuShape™,
a new modeling and library-generation package to meet optical critical dimension
metrology requirements for the 32nm node and below. Developed as part of a cooperative
agreement between KLA-Tencor and Timbre Technologies, Inc., a subsidiary of
TEL, this new software package leverages the strength of the two industry leaders
to enable metrology engineers in IC fabs to measure the dimensions of 3D logic
and memory structures, such as FinFETs*, bulb RCATs**, and structures created
by the advanced patterning technique called spacer pitch splitting. This new
software package operates on KLA-Tencor's stand-alone optical critical
dimension platform, SpectraCD™, and Timbre Integrated Metrology (IM) CD
systems.
As fabs prepare their next-generation chips, they are turning to innovative
patterning technologies and designs to enhance device performance and solve
power-management issues. A new technique called spacer pitch splitting (SPS)
enables fabs to print smaller lines and spaces to enhance device speed and lower
costs. In order to solve leakage current issues associated with small, densely
spaced lines, three-dimensional transistors have also been introduced. The shapes
of these SPS and 3D transistor structures are new to the semiconductor industry,
and control of their widths and profiles can be critical to device yield or
performance. Unlike established CD-SEM technology, which can measure line widths
but has limited ability to measure profiles, the optical CD technology enabled
by AcuShape is well-suited for measuring both line widths and profiles of 3D
features.
“Whether on integrated or stand alone platforms, optical CD measurements
have become more critical to dimensional control as the industry has progressed
through each technology node,” said Jim Hamajima, Timbre president. “At
the 32nm node, we are seeing some very new structures emerging, and the shrink
to 22nm will further increase complexity. The cooperation between KLA-Tencor
and Timbre benefits customers of both companies, bringing new capability for
measuring these structures as they are developed. Furthermore, having a common
platform on their integrated and stand-alone optical CD tools brings efficiency
in training and server resources, which helps in today’s lean manufacturing
environment.”
Ahmad Khan, vice president and general manager of KLA-Tencor’s Films
and Scatterometry Technology (FaST) Division added, “We are delighted
that our year-long project with Timbre and TEL has allowed us to extend the
capability of our successful SpectraCD product line. By giving our customers
tools to manage innovative structures, they will be able to forge ahead with
their next-generation product development.”
Available as an upgrade to the industry-leading SpectraCD products, AcuShape
is a key element in KLA-Tencor’s portfolio of advanced metrology solutions.
AcuShape has been shipped to several memory, logic and foundry fabs in the United
States, Europe, Japan, Korea and Taiwan, where it is being used to measure production
wafers and provide early learning on advanced R&D structures.
The AcuShape trademark is the property of TEL and is licensed to KLA-Tencor.
The SpectraCD trademark is the property of KLA-Tencor Corporation.
*FinFET = “Fin”-shaped Field Effect Transistor (FET)
**RCAT = Recessed Channel Array Transistor