(SWX:AMS) business unit Full Service Foundry today announced the availability
of its patented Through Silicon Via (TSV) technology for foundry customers.
With the TSV technology two eight inch wafers can be electrically connected.
With typical TSV depths of 200um to 300um, it is especially targeting 3D integration
of CMOS ICs and sensor components. Due to a flexible manufacturing concept customer
specific modifications as well as varying wafer thicknesses can be supported.
The patented TSV manufacturing technology is electrically proven and available
The TSV technology addresses a variety of markets demanding 3D integration
of CMOS ICs, photo sensors, gas sensors, power devices or MEMS components such
as automotive, industrial & consumer applications. Foundry customers using
the austriamicrosystems TSV concept immediately benefit from a significantly
reduced form factor, systems cost reduction as well as performance improvements
due to shortened interconnect lengths. A proprietary back side re-distribution
layer concept enables various front and back side IO pad connections and provides
customers with utmost flexibility in IC and sensor arrangement.
“This new 3D integration technology further extends our portfolio of
industry-leading Mixed Signal Analog and High Voltage technologies and provides
customer-specific solutions for sensor integration. The innovative TSV technology
can be combined in a fully flexible manner with any of our 0.35um analog specialty
technologies such as CMOS, HV-CMOS, SiGe BiCMOS or embedded Non-Volatile Memory.
By providing our customers with early manufacturing access to this new technology
we can support them in realizing differentiated systems solutions,” states
Thomas Riener, General Manager Business Unit Full Service Foundry at austriamicrosystems.
“We see our role in providing designers with competitive advantages from
technology which further enhances the competitiveness of their products,”
comments Martin Schrems, Director of Process Development & Implementation
at austriamicrosystems. “In analogy to our leading High-Voltage CMOS technology
we have focused our TSV developments on creating a highly scalable, very low
complexity and cost-effective technology platform. Beyond that TSV is a synergetic
extension to our High-Voltage CMOS technology portfolio.”
austriamicrosystems’ business unit Full Service Foundry has successfully
positioned itself in the analog/mixed-signal foundry market offering well-established
RF CMOS, High-Voltage CMOS, BiCMOS and SiGe-BiCMOS processes. With superior
support during the design phase, high-end tools and experienced engineers, austriamicrosystems
succeeds to be an attractive analog foundry partner especially for fabless design
austriamicrosystems is a leading designer and manufacturer of high performance
analog ICs, combining more than 27 years of analog design capabilities and system
know-how with its own state-of-the-art manufacturing and test facilities. austriamicrosystems
leverages its expertise in low power and high accuracy to provide industry-leading
customized and standard analog products. Operating worldwide with more than
1,000 employees, austriamicrosystems focuses on the areas of power management,
sensors & sensor interfaces, and mobile infotainment in its markets Communications,
Industry & Medical and Automotive, complemented by its Full Service Foundry
activities. austriamicrosystems is listed on the SIX Swiss Exchange in Zurich
Posted May 27th, 2009