SUSS MicroTec Test Systems,
one of the world's leading suppliers of process and testing solutions for markets
as Advanced Packaging, MEMS, Nanotechnology, Compound Semiconductor, Silicon-On-Insulator
and 3D Interconnect, has introduced 1MX™ Technology for its line of on-wafer
RF probes, the |Z| Probe®. The new technology significantly improves the
high-frequency performance of the |Z| Probe by minimizing unwanted signal loss,
reflection, and crosstalk and by extending the frequency range. Design enhancements
provide test engineers with the new level of measurement accuracy when characterizing
nano-scaled RF and microwave devices.
Testing RF and microwave components at wafer level is a challenging task. To
do so, engineers need to connect measurement instrumentation such as the vector
network analyzer (VNA), which interprets signals in a “coaxial transmission
world”, to the device under test (DUT), which exists in a “planar
transmission world”. The meeting of these two worlds takes place at the
RF wafer probe. SUSS MicroTec’s |Z| Probe uses a patented technology to
connect these two worlds with the minimum amount of signal distortion and loss.
In addition, the robust design of the |Z| Probe ensures one million touchdowns,
far exceeding wafer probes using conventional technologies, making it an ideal
choice for on-wafer RF engineering and production test.
“The |Z| Probe family, with its unsurpassed lifetime and excellent contact
quality, reliability and repeatability providing lowest cost of ownership, is
now expanded with the new 1MX Technology”, says Dr. Stojan Kanev, Director
of Marketing and Product Management at SUSS MicroTec. “It significantly
improves the insertion loss and return loss to values never seen before in the
RF probing technology and extends the frequency capabilities of our |Z| Probes
up to 67 GHz.”
The new |Z| Probes are available now. More information about 1MX Technology
and SUSS MicroTec’s complete on-wafer RF and microwave test solutions
can be found on www.zprobe.info.