(Nasdaq:FEIC), a leading provider of atomic-scale imaging and analysis systems,
today announced the newest member of the Helios NanoLab(tm) Family -- the Helios
1200 Full Wafer DualBeam(tm) system. The ability of the Helios 1200 to analyze
full wafers up to 300 mm improves the efficiency of semiconductor and data storage
failure analysis and manufacturing support labs that need to deliver accurate
data quickly to the production floor.
"We've designed the new Helios 1200 DualBeam to provide the maximum productivity
for failure analysis, process development and process control requirements,"
said Larry Dworkin, product marketing manager for FEI's full wafer systems.
"The ability to introduce full wafers directly into the system allows users
to navigate directly to multiple features of interest based on design data or
information from other inspection and defect detection tools. Fast switching
between imaging and milling permits precise, efficient control of the cross
sectioning process. And imaging resolution significantly better than any other
instrument in its class ensures superior analytical results."
The Helios 1200 combines world-class scanning electron microscope (SEM) image
resolution and extremely fast switching between imaging and ion beam milling
to deliver rapid, reliable, efficient cross-sectional analysis of structures
and defects. Its ability to accommodate full wafers up to 300 mm eliminates
the time required to re-establish the navigational coordinate system when working
with wafer pieces.
"In the nearly two years since its introduction, our small-chamber Helios
NanoLab DualBeam systems have been installed at every leading edge fab in the
world," said Rudy Kellner, vice president and general manager of FEI's
Electronics Division. "Now, for the first time, we can offer the same performance
in a full wafer system."
When the analysis demands the higher resolution capability of a dedicated scanning
transmission electron microscope (S/TEM), FEI 's Multiloader(tm) technology
enables fast and secure sample transfer. FEI's new automation software product,
iFAST, improves the quality and consistency of multiple, site-specific samples
in a single session at a cost-per-sample that is competitive with conventional
SEM bulk sample preparations. Optional energy dispersive X-ray spectrometry
(EDS) on thin samples offers compositional analysis with very good spatial resolution.
The optional OmniProbe micromanipulator allows in situ extraction of prepared
TEM lamella. The OmniProbe 300's new in-chamber needle exchange process eliminates
the need to break chamber vacuum to obtain a new probe.
The new Helios NanoLab 1200 DualBeam system is available now.