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Nemotek Technologie Announces Availability of Customized Wafer-Level Packaging Solutions

Published on July 28, 2009 at 8:56 AM

Nemotek Technologie, a manufacturer of customized Wafer-Level Cameras for portable applications, today announced the availability of its customized Wafer-Level Packaging (WLP) solutions. Utilizing reflow compatible materials, Nemotek Technologies WLP offers the flexibility of customized designs based on customer requests and image sensor needs to deliver one of the smallest and thinnest form factors on the market today.

Nemotek Technologie’s new WLP provides a true chip scale package with only 400µm as the minimum thickness. The die size is ultra-small at just 0.6mm, which fits up to 40,000 dies per wafer. This solution is based on advanced WLP technology and delivers Through Silicon Via (TSV), providing customers with thin, reliable, and more sophisticated imaging components for applications including mobile camera phones, mobile computers and other mobile devices used in medical or automotive. Further contributing to its small form factor, the WLP solution also offers Ball Grid Array (BGA) termination without wire bonding. By eliminating wire bonding the WLP provides the smaller size and less space requirements on the board and final packaging.

With reflow compatible materials and without configured design rules, Nemotek is able to build a customized package that efficiently mounts directly to an application assembly board – lowering costs with less components and manual processes. To provide high performing quality products, design flexibility allows Nemotek Technologie to be the single source to manufacture a portfolio of world-class wafer-level offerings from optics to packaging for any type of image sensors.

“By providing flexibility in our design of WLP, Nemotek meets customer demands for tailored solutions based on advanced wafer-level technology,” said Jacky Perdrigeat, CEO of Nemotek Technologie. “We are able to provide a competitive offering by ensuring design flexibility in a small form factor. The availability of our WLP, followed by the recent availability of our WLO solution, is a testament to how we are improving the manufacturing process and serving wafer-level needs.”

Production of Nemotek Technologie’s advanced WLP will take place in its 10,000 m2 facility. This facility includes a certified Class 10 clean room – the first in Africa located in the Rabat Technopolis Park, a hub for technology development in Morocco.

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