At this year's Semicon Europa 2009, FRT
again presents innovative wafer metrology solutions for R+D and process control
tasks in MEMS, semiconductor, and photovoltaic production. A selection of FRT's
products can be viewed and tried for test measurements in hall 3, booth 101
at Semicon Europa in Dresden from October 6th to 8th 2009.
One of these year's highlights is the multisensor metrology tool MicroProf
TTV that precisely determines total wafer thickness variation as well as bow,
warp and flatness according to SEMI standards. Thanks to its multisensor capability,
the tool can be extended with additional sensors based on reflectometry, interferometry,
confocal microscopy and atomic force microscopy, enabling it to reliably perform
complicated inspection tasks such as through-silicon via measurements (TSV)
at ultra high aspect-ratios of up to 1:100.
FRT's unique multisensor technology is the ultimate base for wafer metrology
applications in today's high-tech industries, because it combines various inspection
tasks based on the measurement of film thickness, roughness, contour and 3D
topography into one upgradeable and future-safe metrology tool.
Henrik Leskinen, Manager Equipment Control of the MEMS manufacturer VTI Technologies
states: "... our FRT system turned out to be the most suitable choice for
monitoring process parameters. Due to its flexible sensor-integration concept
and automation capabilities, we are able to conduct measurements both on entire
wafers with regard to TTV as well as local high-resolution measurements."
Whether it is during polishing, lithography or etching of both patterned and
unpatterned wafers of any size, all measurements are highly repeatable and matchable
across multiple inspection tools. To fulfil cleanroom requirements in the backend
and frontend, FRT metrology tools can be configured as EFEM versions with full
automation, robotic wafer handling and SECS/GEM integration.