These new processes will complement SMIC's existing offerings to better support
customer demand worldwide, including in the fast-growing China market. Applications
include multimedia products, graphics chips, chipsets, and mobile devices such
as handsets integrated with 3G/4G.
"Our 45nm technology has been implemented at SMIC's 300mm facility in
Shanghai ahead of schedule and we look forward to a similar result at these
additional geometries," said SMIC's President and CEO, Dr. Richard Chang.
"These new offerings provide our current and new customers a customized
set of solutions to meet their diverse product design-in needs."
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE:
SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and
the largest and most advanced foundry in Mainland China, providing integrated
circuit (IC) foundry and technology services at 0.35um to 45nm. Headquartered
in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three
200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing
mega-fab, a 200mm wafer fab in Tianjin, a 200mm fab under construction in Shenzhen,
and an in-house assembly and testing facility in Chengdu. SMIC also has customer
service and marketing offices in the U.S., Europe, and Japan, and a representative
office in Hong Kong. In addition, SMIC manages and operates a 200mm wafer fab
in Chengdu owned by Cension Semiconductor Manufacturing Corporation and a 300mm
wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation.
Posted on October 14th, 2009