(Nasdaq: KLAC), the world's leading supplier of process control and yield
management solutions for the semiconductor and related industries, introduced
the next addition to its wafer inspection portfolio, the ICOS( )WI-2250. Extending
KLA-Tencor's leading positions within the light-emitting diode (LED) and microelectromechanical
systems (MEMS) market segments, the ICOS WI-2250 is a major breakthrough for
the industry -- offering a dramatic improvement in inspection speed, compared
to currently available products, allowing manufacturers to transition to larger
LED and MEMS wafer sizes. The ICOS WI-2250 system's automated optical inspection
capabilities enable higher quality LED and MEMS products at increased yields.
The new system will allow defect inspection of whole and diced wafers up to
200mm, with macro inspection sensitivity in the pre- and post-dice inspection
(i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.
"The new ICOS WI-2250 addresses our customers' pre- and post-dice decision
needs by helping them overcome the challenge of removing dies that have passed
probe, yet still have visible defects, preventing these defective die from entering
the expensive packaging process," said Jeff Donnelly, group vice president,
Growth and Emerging Markets (GEM) Group at KLA-Tencor. "In addition, the
improved, automated real-time classification and metrology capabilities of the
ICOS WI-2250 are designed to reduce operator reclassification and manual metrology
measurements, while improving inspection accuracy. That combination will lead
to faster cycle time and improved process control, which enables manufacturing
efficiency and increased yield."
Compared with similar products on the market today, the ICOS WI-2250 provides
significantly higher inspection sensitivity to critical LED and MEMS process
defects. The new system also offers advanced rule-based binning (RBB) for real-time
defect classification, advanced metrology capabilities, and faster throughput
for inspection as a result of new inspection and data processing technology,
which allows an increase in inspection speed. This new solution works in conjunction
with the Candela HBLED unpatterned wafer inspection system, to provide comprehensive,
yield-improving inspection coverage to the front-end of the line, including
analysis for disposition, defect reduction and excursion control.
The ICOS WI-2250 wafer inspection system has received multiple orders. For
more information about the ICOS WI-2250, please visit www.kla-tencor.com.