Entegris to Demonstrate Advanced Lithography Solutions at 2010 SPIE, San Jose

Entegris Inc. (Nasdaq:ENTG) will join leading lithography technologists from around the world at the 2010 SPIE Advanced Lithography event Feb. 21 through Feb. 25 in San Jose, Calif.

Specializing in advanced contamination control and microenvironment solutions, Entegris (Booth 120) will present new technical papers and showcase its product portfolio for addressing the most prevalent production challenges in advanced lithography applications, including solutions for:

• Microbridge defects. Entegris offers the IntelliGen® Mini photochemical dispense system to isolate filtration from dispense, helping reduce or eliminate defects during point-of-use photochemical dispense applications without sacrificing dispense repeatability. In addition, the Impact® 5 nm asymmetric UPE and 10 nm Duo photochemical filters employ a surface-modified UPE membrane technology to help minimize chemical exposure.
• Reticle haze defects. With the Clarilite® reticle haze prevention system, Entegris controls haze formation to extend reticle life by reducing the need for frequent cleaning, increasing yield and significantly reducing reticle costs. The system includes the RSP3 reticle pod, RSPX manual purge station, RSPX direct purge cabinet, and the XCDA auto regeneration system.
• Lens haze defects. Entegris offers the Aeronex® gas purification system and the GateKeeper® point-of-use purifier to help remove contaminants in lithography applications using an inorganic regenerable media to purify gas at ambient temperatures to the sub-parts-per-billion (ppb) level.
• Extreme ultra violet (EUV) applications. Entegris also will display several product solutions that help microchip manufacturers adopt emerging EUV manufacturing practices, including the Entegris® EUV reticle pod, pHasor® II bubble-free gasification module, and the Controlled DI water regasification system with pHasor II.

Entegris experts also have authored or collaborated with other industry and research leaders on eight newly-available technical papers and posters focused on solving these critical contamination control challenges. Presentations at the SPIE event include:

• "Considerations for chemical filter performance for low-molecular weight silicon AMC" - Tuesday, Feb. 23, at 6 p.m. in Convention Center Exhibit Hall 2. Focused on reducing lens haze defects.
• "Reticle haze control: global update and technology roadmap" - Wednesday, Feb. 24, at 11:40 a.m. in Convention Center A1. Focused on reducing reticle haze defects.
• "Further analysis of the effect of point-of-use filtration on microbridging defectivity" - Tuesday, Feb. 23, at 6 p.m. in Convention Center A4. Focused on reducing microbridge defects.
• "Immersion lithography microbridge defects: characterization and root cause analysis" - Tuesday, Feb. 23, at 6 p.m. in Convention Center Exhibit Hall 2. Focused on reducing microbridge defects.
• "Particle protection capability of SEMI compliant EUV dual pod" - Wednesday, Feb. 24, at 6 p.m. in Convention Center A4. Focused on enabling EUV applications.
• "Improving material-specific dispense processes for low-defect coatings" - Tuesday, Feb. 23, at 6 p.m. in Convention Center A4. Focused on achieving process improvements.
• "Point-of-use filtration methods to reduce defectivity" - Tuesday, Feb. 23, at 6 p.m. in Convention Center A4. Focused on achieving process improvements.
• "Defect performance of a 2X-node resist with a revolutionary point-of-use filter" - Tuesday, Feb. 23, at 6 p.m. in Convention Center A4. Focused on achieving process improvements.

Source: http://www.entegris.com/