Nemotek Technologie, a manufacturer of customized Wafer-Level Cameras (WLCs), today announced that it is the newest wafer-level fab in the Mediterranean.
Nemotek leverages its existing relationships with European partners and suppliers to produce and ship world-class, wafer-level optic (WLO), wafer-level camera (WLC) and wafer-level packaging (WLP) solutions to global customers. Based on its positioning, Nemotek, with its partners, can respond to growing demands for advanced micro cameras in various applications including mobile phones, notebooks, medical diagnostics such as endoscopy, automotive and consumer electronic devices.
The company’s location in the Mediterranean strategically positions Nemotek to provide advanced high-tech products for the region’s supply chain. Nemotek’s advanced wafer-level solutions utilize advanced Through Silicon Via (TSV), providing customers with thin, reliable, and more sophisticated imaging components. By building the optical elements of the camera module based on reflow compatible materials, Nemotek uses fewer components during manufacturing to create ultra small, tailored lenses that offers higher resolution with extremely low distortion. Customers from sensor manufacturers to camera module makers are looking for new processes to speed up time-to-market and reliability. Nemotek addresses this need by streamlining the production process from complete design to testing of its high quality and low cost wafer-level solutions.
“To be the newest wafer-level fab is a tremendous accomplishment for our team as we continue to push industry standards to improve image quality,” said Jacky Perdrigeat, CEO of Nemotek Technologie. “It is because of our location that we are able to take advantage of European technological advancements and add to the supply chain, placing the Mediterranean on the map for the development and production of high quality lenses. Our market position as a comprehensive wafer-level fab enables our partners, suppliers and customers to work with one source for all their wafer-level needs.”