Agilent Technologies Inc. (NYSE:A) today announced Integrated Circuit Characterization and Analysis Program (IC-CAP) Wafer Professional (WaferPro) software.
The new software provides a multi-site, multi-wafer, automated DC and RF measurement solution for semiconductor device modeling applications.
WaferPro allows users to control semiautomatic and fully automatic probe stations. With support for the latest switch matrix and thermal chuck solutions, WaferPro automates spot and swept measurements across a range of temperatures. WaferPro’s ability to directly control Agilent’s 4070 and 4080 parametric test systems greatly increases measurement speed.
With WaferPro, wafer realignment is handled automatically at each temperature change, removing the need for engineers to supervise measurements. Test plans can run automatically at different measurement stations, with different hardware, allowing maximum utilization of lab equipment. Built on a sophisticated architecture, WaferPro also enables efficient data analysis and processing and provides a foundation for future advanced modeling tasks.
“Device modeling complexity continues to grow, increasing the number of measurements required for extraction and verification,” said Chris Morton, manager of Agilent EEsof EDA’s device modeling business. “Statistical modeling represents a challenge for foundries, but is also a priority for designers dealing with smaller transistors and more complex applications. Additionally, Agilent parametric test systems are being increasingly installed in device modeling labs, not just in a process development and production environment. WaferPro is the first in a series of new products that addresses these challenges head-on.”