By Cameron Chai
Hynix Semiconductor, a company developing Dynamic Random Access Memory chips (DRAMs) and flash memory chips, and SEMATECH recently declared that Hynix is now a member of SEMATECH’s three-dimensional Interconnect program at the College of Nanoscale Science and Engineering (CNSE) in the University at Albany.
Hynix will work with engineers in the program at CNSE’s Albany NanoTech Complex to provide infrastructure and technology input in materials, equipment, integration and product related areas to adopt through silicon vias (TSV) in multiple volumes.
Volume execution of Global research is presently designing advanced technologies and stacked I/O DRAM for mobile applications. The I/O and TSV combination will allow for heterogeneous three-dimensional incorporation and volume manufacture of these products.