By Cameron Chai
Akrion Systems and the MiQro Innovation Collaborative Centre (C2MI) recently declared that C2MI will procure three GAMA automated wet process platforms to help develop and produce advanced devices at C2MI's MEMS unit in Bromont Technoparc, Quebec, Canada.
The systems will be utilized in all the wet processing requisites at the Centre and include technologies that will help dry MEMS wafers exhibiting deep feature sizes and monitor silicon etch kinetics.
Luc Ouellet, vice president of technology development of Teledyne DALSA Semiconductor, said that the multiple MEMS and three-dimensional wafer integration platforms that utilize Through-Silicon Via, TSV, the preparation steps needed for wafer bonding and the different volume micromachining procedures require methods stipulated by the centre for the three immersion wet processors.
The tools offer operators dry-in and dry-out interfaces based on SMIF, lowering inherent risks to humans, to deliver a technically safe solution to fundamental physical restrictions related to high aspect ratio TSV. They enable multiple eco-friendly processes and lower operation costs by using chemicals and de-ionized water. The integrated sub-systems offer automated chemical delivery, composition analysis and rapid micro-contamination control.