By Cameron Chai
Novellus Systems has launched VECTOR conformal film deposition (CFD) films series for its VECTOR Extreme, VECTOR Excel plasma-enhanced chemical vapor deposition (PECVD), and VECTOR Express systems.
The CFD series of dielectric films comprises nitride, oxide, and doped oxide films. These films are deposited at a temperature varying from 500C to 4500C. These films are used in advanced sub-2X nm memory and logic applications. They also offer solutions for bitline spacers, through silicon via (TSV) dielectric liners, resistor protect layers, double patterning spacers that use photoresist cores or amorphous carbon, and front-end-of-line (FEOL) liners and spacers that are used in FinFETs and tri-gate transistors.
Novellus' CFD films’ deposition is carried out through VECTOR's multi-station sequential processing (MSSP) system. This system is designed to satisfy the technical needs for conforming to specifications and to reduce the amount of chemicals consumed. MSSP enables highly uniform films, repeatability and enhanced productivity. MSSP system enables autonomous temperature and process control to its deposition stations to meet integration requirements of sub-3x nm technology-based nodes.
VECTOR CFD film deposition can be done even at temperatures less than 800C. Hence, they can directly be deposited on photoresists. A spacer-based, simple double patterning scheme is enabled that uses the photoresist as the core for patterning. One lithography and one etch step is eliminated ensuring cost benefits.