SUSS MicroTec, an equipment supplier, has partnered with Brewer Science, a provider of processes and materials for thin wafer handling, to commercialize Brewer Science’s ZoneBOND process for thin wafer handling.
Brewer Science designs, develops and produces specialty devices, materials and processes for printed electronics, LEDs, displays, sensors, MEMS, semiconductors, three-dimensional and advanced packaging integrated circuits. SUSS MicroTec in collaboration with industry and academic partners focuses on the development of critical processes for LED and MEMS production and future-generation technologies such as nanoimprint lithography and three-dimensional integration.
The ZoneBond process is an innovative wafer handling solution that offers minimum-stress debonding, superior temperature stability and control over total thickness difference. The process offers various advantages including lower cost of ownership, higher througput and higher output at debonding to customers.
Through this partnership, SUSS MicroTec, a provider of room temperature debonding process devices, now provides the ZoneBOND technology on the XBS300 and XBC300 systems, with focus on high-volume bonding and debonding of 200 and 300 mm wafers utilizing glass or silicon carriers.
Brewer Science delivers uniquely designed products for the application of the ZoneBOND technology such as small-scale debonding devices as well as materials for removers, adhesives and carrier preparation. Through this collaboration, customers will get optimized process solution, equipment and materials as per their needs.
Source: www.brewerscience.com