Enpirion and JiangyinChangdian Advanced Packaging (JCAP) have signed a strategic collaboration deal to produce silicon-based magnetics using the micro-electronic magnetic silicon (MEMS) technology of Enpirion.
Last year, Enpirion’s proprietary MEMS technology showed the required application performance in the company’s DC-DC power system-on-chip at record frequencies of the order of 18 MHz.
The strategic partnership deal will allow the integration of Enpirion’s affordable silicon-based magnetics technology with JCAP’s unique, high-throughput wafer level packaging production operations. JCAP will implement and completely test the special magnetic material processes of Enpirion.
Enpirion’s Chief Executive Officer, Denis Regimbal expressed his happiness about the partnership that will allow the merging of JCAP’s specialized wafer level production capabilities and Enpirion’s sophisticated MEMS technology. Since its establishment, the company has invested substantially for the development of silicon-based magnetic technologies that support its superior-frequency CMOS power technology. With this deal, the company continues its dominance in integrated DC-DC power systems by entering into new areas such as affordable LDO substitutes, he added.
JCAP’s President Lai Chih-Ming commented that the company is happy about its selection to commercialize Enpirion’s sophisticated silicon-based magnetics technology in power applications for the first time utilizing high-throughput chip scale and wafer level bump production capabilities of JCAP. The company believes that this future-generation technology will develop the first-of-its-kind completely integrated silicon-based DC-DC converter at low cost, he added.
Source: http://www.enpirion.com