FlipChip International, a specialist in wafer level packaging (WLP) and flip chip bumping, has inked license, sales and marketing deals with NANIUM, a provider of production, engineering and testing services in the semiconductor industry, for 300 mm WLP and flip chip bumping.
This strategic alliance will offer a platform not only for FlipChip International’s existing bump services for 150 and 200 mm wafers but also for the 300 mm WLP services of NANIUM. As part of this collaboration, FlipChip International’s Spheron plated copper redistribution technology will be licensed by NANIUM.
As per the agreements, NANIUM and FlipChip International will work directly with current and new customers to provide the optimum technology based on their requirements for each application in the future-generation packaging to be used in graphics processors, microprocessors, automotive integrated circuits, tablets, medical devices, wireless 3G and 4G integrated systems, and smart phones.
The President and Chief Executive Officer at FlipChip International, Bob Forcier stated that this strategic collaboration corroborates the worldwide strategic significance of flip chip bumping and WLP for future-generation of products such as tablets and smartphones. This partnership will also offer the most comprehensive global WLP and bumping services in the semiconductor industry.
The President of Executive Board at NANIUM, Armando Tavares commented that tablets, smartphones and other space-constrained and high-performance applications drive the growth of WLP technology. NANIUM and FlipChip International jointly offer a comprehensive portfolio of WLP services for 150, 200 and 300 mm wafers.
Source: http://www.flipchip.com