By Will Soutter
Air Products will showcase its capability in chemistry and thin film deposition at the AVS Atomic Layer Deposition (ALD) Conference 2012. Scheduled to be held this year between June 17 and 20 at the Westin Bellevue in Dresden, Germany, the ALD conference has become a significant annual event owing to the capabilities of atomic layer deposition in meeting the fabrication needs of advanced semiconductor technology.
ALD could facilitate advancement in cloud and mobile computing by addressing the manufacturing requirements of essential complex components such as Tri-Gate/FinFET transistors for logic devices and capacitors with high aspect ratio for Dynamic RAM (DRAM).
Air Products has application labs in California and Korea. The company has stepped up investments in ALD deposition tools and in development of chemical precursors. Dr. Gene Karwacki, the commercial manager for deposition and etching product development at Air Products, stated that their customers have started to realize the benefit of partnering with them to fulfill their process needs. At the ALD conference, the company will present papers authored solely by its R&D team as well as those authored in collaboration with R&D partners.
Some of the papers to be orally presented are Atomic Layer Deposition of Strontium Oxide and Titanate Using Novel Imidazolate Precursors, to be given by Dr. Sergei Ivanov and Atomic Layer Deposition of GST Layers for Phase Change Memories, a collaborative work with Seoul National University. Poster presentations include Group 2 Imidazolate Solutions for Direct Liquid Injection, Aminosilanes for Atomic Layer Deposition of Silicon Oxide, Pushing the Limits of ALD in Process Speed (in collaboration with Beneq) and Investigation of the Growth Properties of Titanium Oxide ALD Depositions (in collaboration with Fraunhofer Center for Nanoelectronic Technologies).