Nov 8 2012
NANIUM, a leading provider of semiconductor packaging, test and engineering services, today announced that it has extended its offering to include fan-in WLP volume production on 300mm wafers.
NANIUM earlier this year licensed Flip Chip International’s (FCI) Spheron® Plated Cu Redistribution technology to provide solutions for 300mm wafer-level chip scale packaging (WLCSP) using fan-in WLP processes. After completing line setup and qualification for that technology, the company added the capability to manufacture fan-in WLP products, which extends its service portfolio using the latest technology on 300mm wafers.
“The conventional fan-in variant of WLP on the silicon wafer, where all IOs are located on the die, offers a cost-effective solution for the required package size, IO count and performance of many IC products,” said Armando Tavares, president of NANIUM’s executive board. “By leveraging our proven WLP processes and know-how, NANIUM is now extending its service offer to cover the full range of wafer-level packaging requests of our customers, fan-in and fan-out.”
Wafer-level chip scale packaging (fan-in WLCSP) enables low-cost manufacturing of small die sizes, with low I/O density, and high performance. The technology includes repassivation, redistribution (RDL), under-bump metallization (UBM), bumping, test, laser marking, singulation, automatic inspection (AOI) and pick and pack in tape and reel.
This technology complements NANIUM’s existing fan-out WLP offer, which is more directed to high-pin / high-performance products, SiPs and 3D integration.
NANIUM recently passed the production milestone of 200 million components using embedded wafer-level ball grid array (eWLB), a fan-out WLP technology.
Visit NANIUM:
- The International Wafer-Level Packaging Conference (IWLPC), Nov. 7-8 in San Jose, Calif., USA; Booth 3
- Electronica, Nov. 13-16 in Munich, Germany; Hall A6, Booth 180
Source: http://www.nanium.com