Mattson Technology, Inc., a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has shipped its Helios® XP rapid thermal processing (RTP) system to a fourth major foundry customer. The Helios XP will be used for the volume production and development of next-generation chips at leading-edge technology nodes.
"At the 2X nanometer and below process regimes, where smaller transistors are more sensitive to temperature variations, achieving uniformity across the die becomes increasingly challenging," said Johannes Keppler, senior director and general manager of Mattson Technology's Thermal Products Group. "The Helios XP's patented dual-side heating and differential thermal energy control (DTEC) technology dynamically controls within-die temperature and reduces pattern loading effect to provide unparallelled temperature uniformity and minimized wafer stress for advanced transistor manufacturing."
Keppler concluded, "Since the introduction of the Helios XP in 2009, the system has been demonstrating its advanced thermal processing capabilities, and the addition of our fourth foundry customer further validates the system's success in addressing their most critical foundry challenges. This latest Helios XP shipment reinforces the strength of our RTP position in the critical foundry area, where we are now positioned at the top four leading semiconductor foundries in the world. We look forward to supporting our foundry customers with technologically advanced tools that deliver excellent thermal processing performance and low cost of ownership to help them achieve the highest yields in their production ramp of next-generation chips."