STATS ChipPAC's Packaging Innovations Adopted by Spreadtrum for Mobile Chipsets

Published on January 24, 2013 at 3:11 AM

STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX: S24) today announced implementation of breakthrough performance and packaging innovation in multiple advanced chipsets for the rapidly developing smartphone market in China. Spreadtrum Communications, a leading fabless semiconductor provider in China, has adopted STATS ChipPAC's packaging innovations for a number of its mobile chipsets.

The combination of Spreadtrum's advanced silicon design capabilities with STATS ChipPAC's next generation embedded Wafer Level Ball Grid Array (eWLB) packaging technology offers increased performance and compact form factor at a competitive cost for the fast-growing China smartphone market.

Spreadtrum offers mobile chipsets for a range of smartphones, feature phones and other consumer electronics products that support 2G, 3G and 4G wireless communications standards. Spreadtrum's TD-SCDMA (time division synchronous code division multiple access) chipsets have set a new standard for increased performance and size reduction in the highly competitive smartphone market in China. TD-SCDMA is a 3G mobile telecommunications standard that is currently utilized in China to enable data, voice, video and media in mobile phones and internet-enabled devices.

"China is now the single largest smartphone market in the world and is rapidly growing," said Brian Chen, Vice President of Operations at Spreadtrum. "By combining our unique chip architecture and leading TD-SCDMA modem technology with STATS ChipPAC's technology and manufacturing leadership, we have been able to deliver high performance TD-SCDMA chipsets in a package format that continues to provide Spreadtrum and our customers with a clear competitive advantage in the China market."

eWLB is a powerful fan-out wafer level packaging (FOWLP) technology and integration platform that provides significant advantages including a more space-efficient package design enabling a smaller footprint, higher density input/output (IO) and a lower package height than is possible with laminate or flip chip semiconductor packages. Spreadtrum and STATS ChipPAC are jointly working to utilize innovative packaging technology across a full spectrum of complex product designs such as dual and quad core mobile processors.

"Our extensive collaboration with Spreadtrum demonstrates the transformative advantages of eWLB technology. We have been able to rapidly optimize the overall functional performance of their silicon with an innovative packaging technology designed to optimize speed, performance and size at an overall lower cost of ownership," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. "Spreadtrum's success in China and beyond is evident by the numerous product introductions and global customer wins they have had and we are excited to be working together to drive innovations in the smartphone market."

Source: http://www.statschippac.com/

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