Research and Markets has announced the addition of the "Avago FBAR Filter All-Silicon MEMS Duplexer Reverse Costing Analysis" report to their offering.
The highest volume production MEMS using TSV Technology based on AlN piezoelectric active layer
With more than 1 Billion units produced per year and a market share of 65%, Avago Technologies clearly dominates the BAW filter market. The ACMD-7612 is an UMTS Duplexer manufactured with Avago's film bulk acoustic resonator (FBAR) technology which uses AlN piezoelectric material for resonating layers.
The filters are hermetically wafer-level packaged with Avago's Microcap bonded-wafer CSP technology, allowing the filters to be assembled in a molded chip-on-board module of less than 1.2 mm high.
TSVs are etched in the cap in order to report electrical contacts and thus reduce filter dies size.
The ACMD-7612 is targeted for handsets or data terminals operating in the UMTS Band I frequency range and features a Maximum RF Input Power to Tx Port of ±33 dBm.
This report provides complete tear-down of the FBAR duplexer with:
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Detailed photos
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Material analysis
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Schematic assembly description
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Manufacturing Process Flow (including AlN process, wafer capping and TSV manufacturing)
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In-depth manufacturing cost analysis
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Supply chain evaluation
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Selling price estimation
Key Topics Covered:
Glossary
Overview/Introduction
Company Profile
Physical Analysis
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Physical Analysis Methodology
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Package Characteristics & Markings
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Package X-Ray
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Package Opening - Main Parts
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Package Cross-Section
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MEMS Dies Dimensions
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MEMS Dies Markings
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MEMS Dies Bond Pads & TSV
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Tx Die Opening
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Tx Die Cap
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Tx Die FBAR
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Rx Die Opening
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MEMS Die Cross-section - Overview
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MEMS Die Cross-section - TSV
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MEMS Die Cross-section - Membrane
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MEMS Die Cross-section - Contacts
Manufacturing Process Flow
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Global Overview
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MEMS Process Overview
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FBAR Process Flow
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Cap Process Flow
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Wafer Bonding Process Flow
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Description of the Wafer Fabrication Unit
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Component Packaging Process Flow
Cost Analysis
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Synthesis of the Cost Analysis
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Main Steps of Economic Analysis
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Yields Explanation
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Yields Hypotheses
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Dies per wafer & Probe Test
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MEMS Front-End Cost
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MEMS Front-End cost per Process Steps
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Back-End 0: Probe Test & Dicing Cost
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MEMS Dies Cost
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Back-End: Packaging Cost
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Back-End: Packaging Cost per steps
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Back-End: Final test Cost
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ACMD-7612 Component Cost (FE + BE 0 + BE 1)
Estimated Price Analysis
Source: http://www.researchandmarkets.com