Applied Nanotech to Present Advancements in Inks and Pastes at Printed Electronics Europe 2013

Published on April 3, 2013 at 5:13 AM

Applied Nanotech Holdings, Inc. announced that its subsidiary, Applied Nanotech, Inc., will be presenting its latest advancements in inks and pastes for printed electronic applications at the prestigious 10th International Conference and Trade Show on printed electronics organized by IDTechEx in Berlin, Germany April 17-18, 2013.

More information on the show can be obtained at www.idtechex.com/printed-electronics-europe/pe.asp.

Applied Nanotech will be located in booth G7 and will exhibit its copper, aluminum, nickel, and silver inks and pastes. Furthermore, at this trade show ANI will present its revolutionary new printed circuit board (PCB) concept that integrates printed electronics with its high thermal conductivity substrate, CarbAl™ (see for example "Power Electronics PCB Concept Supports Thermal Management" published in "Power Electronics Technology," page 23, October 2012).

At the show, Applied Nanotech will also have additional public information available about its significant new intellectual property that is scheduled to be issued in April 2013 related to its copper and silicon nanoink formulations and processing methods.

"Although the printed electronic industry is developing, and the number of applications is increasing, there is still a roadblock due to the high cost of copper materials suitable for the printed electronic efforts," said Dr. James Novak, Director of Nanoelectronics and Thermal Management Division. "The new copper material, Cu-iM530, presented by ANI at this trade show may provide a solution to the high cost barrier."

Source: http://www.appliednanotech.net/

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